PAC PCB

Over 40 years of experience in printed circuit board manufacturing. It was 1970 when Sandro Bezzetto began the artisan production of mountings and equipment for the electronics; today P.A.C. is among the leaders in the market for PCB (Printed Circuit Board), with features that everyone says they have but few of them can demonstrate of having:

Reliability, balance between quality and price and on-time deliveries. For more than forty years the company has met the demands of the electronic, automation, power, robotics, telecommunications, and lighting sectors in order to expand its horizons and be in a position to watch and become part of the evolution of this market, directly developing new production processes and systems aimed at implementing small, medium and large series of high quality printed circuit boards.

Production:

• CAD DESIGN
  It sets the entire production cycle of the printed circuit board, starting from an accurate check of the customer drawing up to the implementation of all the necessary equipment to produce the printed circuit board.
• LAMINATE CUTTING
  In this department, the various sheets of laminate (raw material) are cut in adequate size panels for the production of the printed circuit boards. Different types of materials are available ranging from 0.2 to 4.0 mm in thickness, with related copper thicknesses ranging from 17, 35, 70, 105, to 400 microns.
• DRILLING
  It is carried out using different CNC machines, which guarantee maximum hole precision. We have the latest technology on the market by making available for the customer the highest productivity thanks to the GIGA 8888L drilling machine with 8 heads that allows us to drill and mill in a short time very large batches of printed circuits.
• DIRECT METALIZATION
  The process called “DMSE”, based on conductive polymer, allows and guarantees, in the subsequent galvanic stage, the deposit of copper on the wall of the hole.
• YELLOW ROOM
  The image of the printed circuit board on the panels and subsequently also the correct image of the solder resist are obtained in this department through a photographic process.
• GALVANIC PROCESS
  In this department, the deposit of the electrolytic copper on the wall of the hole and on the uncovered copper surface takes place, then a tin-plating of the entire image of the circuit board occurs to protect it in the subsequent engraving stage.
• STRIPPING -ENGRAVING
  These processes allow the photographic materials to be removed, (previously used to protect the copper part which is not necessary to the circuit diagram) together with the excess copper, thus obtaining tracks and pads as required.
• SILK-SCREEN / PHOTOGRAPHIC PRINTING
  The solder resist and component symbols are silk-screen printed on the circuits, by using paints of different colors.
• V-SCORING
  A “V” shaped separation grooving is carried out on the whole printed circuit, by using precision “widia” or diamond discs; then the CNC machines pre-cut the boards, on both surfaces, thus allowing, after component assembly, the separation of the whole printed circuit board into individual elements.
• ELECTRICAL TEST
  A functional check on 100% of the production batch is carried out by using special machines, including a “PRECISE Machine” which performs a double tests on the PCB. This process, together with all the other checks carried out during the production cycle, allows us to deliver to our customers a HIGH QUALITY product.
• CHEMICAL TIN LINE
  Manufacturing process for the production of “lead-free PCBs”. It consists in a selective chemical tinning, perfectly planar and highly weldable that allows to deposit, only on the welding pad, a compact and crystalline layer of pure tin, thanks to a particular product organometallic, which is interposed between the copper and tin, slowing the formation of intermetallic compounds.